- Description
Description
| Specification | Details |
|---|---|
| Type | Thermal Paste (Heatsink Compound) |
| Composition | Silver-based thermal compound |
| Weight | 1 gram |
| Thermal Conductivity | 5–12 W/m·K |
| Thermal Resistance | 0.002–0.1 °C·in²/W |
| Operating Temperature | -50°C to 180°C |
| Electrical Conductivity | Non-conductive or slightly capacitive |
| Viscosity | Medium to high |
| Curing Time | No curing required (immediate performance) |
| Application | CPU, GPU, heatsinks, chipsets, LEDs |
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